SEMESTER-III

EL - 304 Communication electronics

Signals and systems. AM/ FM transmitters, revision of transmission concepts from RF and microwave,antenna, propagation of em waves, ground, duct and sky wave propagation.
Superheterodyne radio receiver, Video signal transmission, and reception, television receiver, monochrome and colour.

Telephone communication, manual and automatic switching networks, Strowger, Crossbar and Stored program switching, speech digitization and transmission, traffic engineering , numbering plan, facsimile, radio paging and other telecommunication services, cellular mobile and satellite communication, Optical fiber communication systems, digital communication principles, FDM, TDM and WDM systems.

Information theory, Shanon?s definition of information, entropy, capacity of a channel, Shanon?s theorem.

Sampling and digitization of analog signals, transmission coding, code compression, error detection and correction codes, data security, encryption/decryption algorithms.

Data communication, DTE, DCE, MODEMs, FSK, PSK, DPSK, PCM, Delta modulation, Compading, CODECs.

Computer networking and internet, OSI model, Network topologies, network architectures and protocols, ISDN.

EL - 305 Microprocessors and Applications

Processor architecture, CISC and RISC architectures, ALU design, pipelined instruction execution, Architectural concepts of Intel 8086 family including 80286, 386,486, Pentium, Microcontrollers.
Instruction formats, addressing modes, instruction sets, assembly language programming, use of assemblers, macros, program looping, subroutine linkage, reentrancy and recursion.

Operating system fundamentals, multi user multi tasking OS, DOS, Windows and Unix.

Interfacing Memory and I/O devices, address space partitioning, Memory management, Virtual memory, Common peripherals and their interfacing.

I/O devices for process control and instrumentation, transducers, signal conditioning circuits, instrumentation amplifier, programmable gain amplifier, S/H, analog multiplexers, data acquisition systems, timers and counters, PC addon cards.

Data transfer schemes, programmed data transfer, synchronous and asynchronous transfer, interrupts, enabling, disabling, masking, prioritizing interrupts, Direct Memory Access (DMA) data transfer, Serial data transfer, GPIB and RS-232C protocols.

Development and troubleshooting tools, single board microcomputer kits, simulators, In Circuit Emulators , Logic analyzer.

Design of Embedded systems, microcontoller based system design, application examples, temperature monitoring and control system, DC motor speed controller, ECG data acquisition and monitoring system, electrical characterization systems for semiconductor parameter analysis.

EL - 306 Semiconductor Science and Technology

Crystal growth and wafer preparation, Cz and Bridgeman techniques, ingot shaping, wafering, lapping and polishing, chemical polishing.
Epitaxial growth, VPE, LPE and MBE, mechanism, apparatus and methods of evaluation of EPI-layers.

Diffusion, theory of diffusion, mechanism and physical phenomena, diffusion models for constant source and limited source cases, effect of temperature, electric field, substrate material, orientation, defects and type of impurity species.

Oxidation, Deal Grove model of thermal oxidation, dry, wet, rapid thermal, pyrogenic and steam oxidation, chlorine enhanced oxidation, dependence on process and substrate parameters, quality of oxide, oxidation induced staking faults, anodic and plasma oxidation.

Ion implantation, ion implantation system and principles, implant model, penetration range, backscattering, staggling, channeling, Annealing and sintering. Deposition techniques, CVD and PVD, Laser ablation, Laser annealing and mixing.

Lithography, phtolithography, EBMF and X-ray lithography, Wet chemical etching, lift off process and plasma etching.

Clean rooms, class of clean rooms, filter, air curtains, air showers, particle counters, De-ionized water, DI plant, purity of gases and materials, Quartzware, furnaces, gas bubblers and other apparatus in fab labs, components of fab systems including valves, flowmeters, gas links, vacuum links, sealing, gas leakage detection systems, laboratory hazards and their prevention.

Bonding and packaging processes.

Electrical, physical and chemical characterization techniques.

I-V, C-V, device performance, stress, strain, thickness, hardness testing etc., XPS, IR, UV-VIS spectroscopy, SEM.

EL - 307 Project

Project literature review.
Time management and resource planning.

Presentation and Appreciation.