SEMESTER-III

EL - 314 Electronic Communication Systems
Signals and systems. revision of transmission concepts from RF and microwave,antenna, propagation of em waves, ground, duct and sky wave propagation. Noise in communication systems, sources and types of noise.
Amplitude modulation- DSSBC, DSBTC, SSB, VSB, AM demodulators, Coherent and incoherent demodulation, IC modulators and demodulators. Frequency modulation and demodulation, Broadband FM and FM stereo, Phase modulation and demodulation, Narrowband and broadband PM.

Concepts of sound recording and reproduction, PA Systems, mixers, distribution amplifiers, filters, equalizers, mono and stereo systems, Superheterodyne radio receiver.

Video signal transmission, and reception, camera and picture tube, scanning, synchronization and composite video signal, television receiver, monochrome and colour, NTSC, PAL and SECAM systems, CCTV, HDTV, CATV and DTH, concepts of Home Theatre.

Principles of Telemetry.

EL - 315 Embedded System Applications
Interfacing Memory and I/O devices, Common peripherals and their interfacing, Data transfer schemes, programmed data transfer, synchronous and asynchronous transfer, interrupts, enabling, disabling, masking, prioritizing interrupts, Direct Memory Access (DMA) data transfer, Serial data transfer, GPIB, RS-232C, I2C, CAN bus protocols.
I/O devices for process control and instrumentation, transducers, signal conditioning circuits, instrumentation amplifier, programmable gain amplifier, S/H, analog multiplexers, data acquisition systems, timers and counters

RF ID, Smart cards, PDA?s, Zip drives, Consumer applications, Automotive control.

EL - 316 Semiconductor Foundry Techniques
Crystal growth and wafer preparation, Cz and Bridgeman techniques, ingot shaping, wafering, lapping and polishing, chemical polishing.
Clean room techniques: Clean rooms, class of clean rooms, filter, air curtains, air showers, particle counters, De-ionized water, DI plant, purity of gases and materials, Quartzware, furnaces, gas bubblers and other apparatus in fab labs, components of fab systems including valves, flowmeters, gas links, vacuum links, sealing, gas leakage detection systems, laboratory hazards and their prevention.

Fabrication Equipment: Diffusion and oxidation furnaces, Mask aligners, Mask preparation techniques.

Co-ordinato graph, e-beam lithography machine, step and repeat camera, Ion implanters, Vacuum systems, sputtering techniques ? DC, RF, magnetron, Gas handling equipment, Bonders ? thermal, thermosonic, ultrasonic, Cleaning and etching baths.

Assembly and packaging: Package types, package fabrication techniques:ceramic package glass sealing, plastic moulding, Hermetic sealing, metal can package, package design consideration Reliability issues

EL - 317 Telecommunication Systems
Telephone communication, manual and automatic switching networks, Strowger, Crossbar and Stored program switching, analog and digital exchanges, speech digitization and transmission, traffic engineering, numbering and charging plan, facsimile, WLL, radio paging and other telecommunication services.
Mobile communication systems, cellular concepts, role of base station and mobile switching centers, Hand-off considerations, frequency reuse, roaming, SMS, GSM, GPRS, CDMA and EDGE, Speech coding techniques, Vocoders.

Satellite communication principles and GPS.

EL - 318 Real Time Operating Systems
Introduction to real-time concepts, Example real-time applications, Hard vs. soft real time, Reference model, Classic uniprocessor scheduling, Static scheduling, Dynamic scheduling, Dynamic-priority scheduling, Static-priority scheduling, Dealing with complexities arising in real systems, Practical considerations.
Resource sharing, Priority inheritance and priority ceiling protocols, stack resource protocol. systems A quick look at some real systems

Basic operating-system functions needed for real-time computing, Overview of operating Systems.

A brief survey of commercial real-time and non-real-time operating systems: Embedded OS, Real Time OS, Hand held OS.

Porting RTOS on a Microcontroller based development system board, Programming in Linux, Shell programming, System Programming.

Programming in RT Linux.

EL - 319 Sensor Fabrication techniques
Practical difficulties associated with the fabrication of sensors, technologies such as thin/thick films, silicon micromachining, SAW used in different domains.
Electronic components, specifications of commercially available components, modern package like SMDs.

MEMS Technology, What are MEMS, Why silicon, micromachining processes, Different structures in MEMS e.g. Cantilever, grooves, diaphragms, comb lines etc, design considerations, sensors such as accelerometer, pressure, gears, flowmeters etc.